General
Standard curve Curve DT-670
Recommended excitation 10 µA ±0.1%
Max reverse voltage 40 V
Max current before damage 1 mA continuous or 100 mA pulsed
Dissipation at recommended excitation 16 µW at 4.2 K; 10 µW at 77 K; 5 µW at 300 K
Thermal response time SD: typical <10 ms at 4.2 K, 100 ms at 77 K, 200 ms at 305 K; BR: 1 ms at 4.2 K, 13 ms at 77 K, 20 ms at 305 K
Use in radiation Recommended for use only in low-level radiation — more information
Use in magnetic field Not recommended for use in magnetic field applications below 60 K. Low magnetic field dependence when used in fields up to 5 T above 60 K — more information.
Reproducibility1 ±10 mK at 4.2 K
Soldering standard J-STD-001 Class 2
1 Short-term reproducibility data is obtained by subjecting sensor to repeated thermal shocks from 305 K to 4.2 K
Range of use
Package | Minimum limit | Maximum limit |
SD, CU-HT2, BR | 1.4 K | 500 K |
CU, LR, CY, ET, MT, BO, HR | 1.4 K | 420 K |
2 The high-temperature variant of the CU package (CU-HT) requires immersion in liquid cryogen or vapor to achieve the specified performance. Sensors mounted in vacuum may operate with reduced performance close to base temperature due to reduced thermal performance. See package information for more details.
Temperature response data table
| DT-670 | DT-621-HR |
| V (volts) | dV/dT (mV/K) | V (volts) | dV/dT (mV/K) |
1.4 K | 1.64 | -12.5 | — | — |
4.2 K | 1.58 | -31.6 | 1.678 | -35 |
10 K | 1.38 | -26.8 | — | — |
77 K | 1.03 | -1.73 | 1.03 | -1.73 |
305 K | 0.560 | -2.30 | 0.560 | -2.30 |
Expanded response table