Lake Shore Cryotronics will be discussing their high-frequency material and device measurement technology at the 40th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz) next week in Hong Kong.

Nelson Chen, Lake Shore International Sales Manager, will be answering questions about Lake Shore’s fully integrated Model 8501 THz system for characterization of research-scale materials, as well as the company’s planned THz-frequency contact probing arm for cryogenic probe station measurement applications.

Lake Shore designed the Model 8501 as a fully integrated platform for exploring phenomena in emerging electronic and magnetic materials over a range of temperature and fields using non-contact THz-frequency energy. The system uses uniquely designed continuous wave THz (CW-THz) emitter and detector components for measuring at 200 GHz to 1.5 THz frequencies and spectral resolution of better than 500 MHz.

Because the system includes a high-field cryostat and superconducting magnet, spectroscopic responses of material properties can be measured across a range of temperatures and field strengths. All of the calibrations of THz components have already been done, and no special optics knowledge is required by end users. For ease of use, the system’s software features an intuitive GUI and tools for quick setup of measurement profiles, automating measurement runs, and performing real-time visualization of data as it is being collected.

Separate from the Model 8501 for materials characterization is Lake Shore’s THz-frequency probe arm, which the company plans to make available later in 2015. It is designed to enable precise, on-wafer probing of millimeter wave devices and materials at THz frequencies (75 GHz and up) in Lake Shore CPX, CPX-VF, CRX-4K, or CRX-VF probe stations. With the arm, cryogenically rated probe, and compatible VNAs installed on a station, researchers will be able to perform calibrated S-parameter and other high-frequency electrical measurements at cryogenic temperatures and in high magnetic field for next-generation electronics R&D.

For more information, visit IRMMW-THz Booth #29.