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Bare Chip Sensors | | BC
- Bare chip with 2 copper leads (42AWG) | | | |  | | | | | | | | BG
- Bare chip with 2 or 4 gold leads | | | |  | | | | | | | | BR
- Bare chip, no leads | | | |  | |  | | | | | Copper Canister Package | | AA | | | |  |  |  | | | | | | CD
- Copper bobbin | | | |  |  |  | | | | | Hermetically Sealed Package | | DT-SD |  |  | | | | | | | | | | CO
- Clamp |  |  |  |  | | | | | | | | ET
- Screw-in |  |  |  |  | | | | | | | | MT
- Screw-in (metric) |  |  |  |  | | | | | | | | CU
- Copper bobbin (small, 4-lead) |  |  |  |  | | | | | | | | DI
- Copper bobbin (small, 2-lead) |  |  |  |  | | | | | | | | CY
- Copper bobbin (large, 2-lead) |  |  |  |  | | | | | | | | LR
- Half-rounded cylinder |  |  |  |  | | | | | | | | BO
- Beryllium oxide heat sink block |  |  | |  | | | | | | | | CX-SD | | | |  | | | | | | | | TG-120-SD | | |  | | | | | | | | Platinum Mounting Adapters | | AL | | | | | |  | | | | | | AM | | | | | | |  | | | | Unique Packages | | CB | | | | | |  | | | | | | CS-501-GR | | | | | | | | |  | | | DT-414 |  | | | | | | | | | | | HR |  |  | | | | | | | | | | RF-800 | | | | | | | |  | | | | TG-120-P | | |  | | | | | | | | | TG-120-PL | | |  | | | | | | | |
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Packages
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Cernox™ Packages |
Silicon Diode Packages |
Germanium, Rox™, Rhodium-Iron, and Carbon-Glass Packages |
Platinum Packages |
Capacitance Packages |
GaAlAs Packages |
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 | | | Packaging material: | Ceramic oxynitride, gold pads and sapphire substrate with Au Pt Mo back (chip in all models)
| | Leads: | | | Lead material: | 2.5 mil (42 AWG) bare copper 25 mm long wires | | Mass: | |
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|  | | | Packaging material: | Ceramic oxynitride, gold pads and sapphire substrate with Au Pt Mo back (chip in all models) | | Leads: | | | Lead material: | 2 mil (44 AWG) bare gold 25 mm long wires
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|  | | | Packaging material: | Ceramic oxynitride, gold pads and sapphire substrate with Au Pt Mo back (chip in all models) | | Leads: | | | Mass: | |
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|  | - Used with Cernox™, Carbon-Glass, Rhodium-Iron, Germanium, and Rox™ sensors
| | Adapter material: | Gold-plated cylindrical copper canister, BeO header, Stycast® epoxy | | Leads: | Four 32 AWG × 150 mm (6 in) long Rox™: Two 32 AWG × 150 mm [6 in] long)
| | Lead material: | Phosphor bronze insulated with polyimide (Rox™: copper insulated with Formvar®) | | Mass: | 0.091 g (empty)
Once sensors are installed, total mass increases to 0.197 g to 0.416 g. Refer to individual sensor specifications. | | Limitation: | The epoxy limits the upper useful temperature of this configuration to 400 K |
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|  | - AA canister sensor soldered into a flat, copper bobbin with the sensor leads thermally anchored to the bobbin
- Can be mounted to any flat surface with a 4-40 screw (not supplied)
- Used with Cernox™, Carbon-Glass, Rhodium-Iron, Germanium, and Rox™ sensors
| | Adapter material: | Copper bobbin, gold-plated (AA canister epoxied to bobbin) | | Leads: | 0.91 m (36 in), 36 AWG, color-coded, Quad-Lead™ | | Lead material: | Phosphor bronze Grade A alloy | | Limitation: | The epoxy limits the upper useful temperature of this configuration to 378 K
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|  | - Small package designed primarily for bonding or clamping to a flat surface
- Indium, silver epoxy, 2850 Stycast® epoxy, or a CO clamp may be used for mounting
| | Packaging material: | Sapphire base with alumina body and lid. Molybdenum/manganese metallization on base and lid top with nickel and gold plating. Gold tin solder as hermetic lid seal. | | Adapter material: | | | Leads: | | | Lead material: | | | Mass: | | | Limitation: | The useful upper temperature limit of this configuration is 500 K |
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|  | | | Packaging material: | | | Adapter material: | Gold-plated copper (nickel strike); spring is ASTM A313 302 Austenitic steel | | Leads: | | | Lead material: | | | Mass: | 1.8g (including SD package and clamp) | | Limitation: | The useful upper temperature limit of this configuration is 500 K |
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|  | - Convenient screw-in package formed by indium soldering a basic SD configuration into a recess in one flat of a hexagonal screw head
- The head terminates in a standard SAE 6-32 threaded stud allowing the sensor to be threaded into a mounting hole in the sample
| | Packaging material: | | | Adapter material: | Gold-plated copper SAE-threaded screw head #6-32 | | Leads: | | | Lead material: | | | Mass: | 1.5 g (including SD package and screw-head) | | Limitation: | Indium solder limits the upper useful temperature of this configuration to 420 K |
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Note: A light coating of vacuum grease on the threads further enhances the thermal contact between the sensor package and the sample.
| | Packaging material: | | | Adapter material: | Gold-plated copper metric threaded screw head 3 mm × 0.5 metric | | Leads: | | | Lead material: | | | Mass: | 1.5 g (including SD package and screw-head) | | Limitation: | Indium solder limits the upper useful temperature of this configuration to 420 K |
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|  | - SD packaged sensor indium-soldered into a flat copper bobbin with the leads thermally anchored to that same bobbin
- HT (high temperature) version is soldered using high temperature (90% Pb, 10% Sn) solder
- Can be mounted to any flat surface with a 4-40 screw
| | Packaging material: | | | Adapter material: | Gold-plated copper bobbin (SD indium-soldered to adapter and wrapped in Stycast® epoxy); high temperature CU uses high temperature (90% Pb,10% Sn) solder 500 K | | Leads: | Four 0.91 m (36 in), 36 AWG, color-coded Quad-Lead™ Note: DT-670-CU-HT diodes have Quad Twist™ leads
| | Lead material: | | | Mass: | 1.1 g (including SD package and bobbin, excluding leads) | | Limitation: | The epoxy limits the upper useful temperature of this configuration to 378 K (high temperature CU-HT upper temperature limit is 420 K with Cernox™ and 500 K with silicon and GaAlAs diodes) |
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|  | | | Packaging material: | | | Adapter material: | Gold-plated copper bobbin (SD indium-soldered to adapter and wrapped in Stycast® epoxy); high temperature CU uses high temperature (90% Pb,10% Sn) solder | | Leads: | 0.91 m (36 in), 36 AWG, color-coded, 2-lead ribbon cable | | Lead material: | | | Mass: | 1.1 g (including SD package and bobbin, excluding leads) | | Limitation: | The epoxy limits the upper useful temperature of this configuration to 378 K (high temperature CU-HT upper temperature limit is 420 K with Cernox™ and 500 K with silicon and GaAlAs diodes)
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|  | - Similar to the DI package, except the bobbin is larger in diameter with a centered mounting hole
- Relatively large-sized, robust
| | Packaging material: | | | Adapter material: | Gold-plated copper bobbin (SD indium-soldered to adapter and wrapped in Stycast® epoxy) | | Leads: | Two 0.91 m (36 in), 30 AWG color-coded Teflon®-coated leads | | Lead material: | | | Mass: | 4.3 g (Including SD package and bobbin, excluding leads) | | Limitation: | The epoxy limits the upper useful temperature of this configuration to 400 K |
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|  | - With an SD packaged sensor mounted on a slightly-more-than half-rounded cylinder, this package is designed to be inserted into a 3.2 mm (1/8 in) diameter hole
| | Packaging material: | | | Leads: | | | Lead material: | | | Mass: | 0.2 g (Including SD package and disk) | | Limitation: | Indium solder limits the upper useful temperature of this configuration to 420 K |
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|  | - SD package is soldered to a mounting block and the leads are thermally anchored (without epoxy) to the block via a beryllium oxide insert
- Since leads can be a significant heat path to the sensing element and can lead to measurement errors when incorrectly anchored, this configuration helps maintain the leads at the same temperature as the sensor
| | Packaging material: | Gold-plated bolt-on copper block with leads thermally anchored to block (SD indium-soldered to adapter) | | Leads: | | | Lead material: | | | Mass: | 1.5 g (including SD package and screw-head) | | Limitation: | Indium solder limits the upper useful temperature of this configuration to 420 K |
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- Small package designed primarily for bonding or clamping to a flat surface
- Indium, silver epoxy, 2850 Stycast® epoxy, or a CO clamp may be used for mounting
| | Packaging material: | Sapphire base with alumina body and lid. Molybdenum/manganese metallization on base and lid top with nickel and gold plating. Gold tin solder as hermetic lid seal.
| | Leads: | | | Lead material: | Gold-plated copper soldered with 60/40 SnPb | | Mass: | | | Limitation: | The useful upper temperature limit of this configuration is 500 K |
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- Small package designed primarily for bonding or clamping to a flat surface
- Indium, silver epoxy, 2850 Stycast® epoxy, or a CO clamp may be used for mounting
| | Packaging material: | Sapphire base with alumina body and lid. Molybdenum/manganese metallization on base and lid top with nickel and gold plating. Gold tin solder as hermetic lid seal.
| | Leads: | | | Lead material: | | | Mass: | | | Limitation: | The useful upper temperature limit of this configuration is 500 K
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|  | - T-102 (AL) or PT-103 (AM) mounted into a flat aluminum block
- Can be mounted to any flat surface with a 6-32 or M3 screw (not included) and Inconel® Belleville washer (included)
| | Adapter material: | 6061 Al block (PT mounted to adapter using Cotronics Durabond® 950 Al-based adhesive) | | Leads: | Two 0.010-inch diameter: 10.160 ±1.270 mm (0.400 ±0.050 in) long
| | Lead material: | | | Mass: | | | Limitation: | The aluminum alloy limits the upper useful temperature of these configurations to 800 K |
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|  | - PT-102 (AL) or PT-103 (AM) mounted into a flat aluminum block
- Can be mounted to any flat surface with a 6-32 or M3 screw (not included) and Inconel® Belleville washer (included)
| | Adapter material: | 6061 Al block (PT mounted to adapter using Cotronics Durabond® 950 Al-based adhesive) | | Leads: | Two 0.010-inch diameter: 15.240 ±1.270 mm (0.600 ±0.050 in) long | | Lead material: | | | Mass: | | | Limitation: | The aluminum alloy limits the upper useful temperature of these configurations to 800 K |
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|  | - The RX-102B-CB (1000 Ω at room temperature) is useful down to 10 mK (calibrations available down to 20 mK) and monotonic from 10 mK to 300 K. The unique package design maximizes thermal connection and minimizes heat capacity at ultra low temperatures. The RX-102BCB is not interchangeable to a standard curve and not recommended for use in magnetic fields.
| | Packaging material: | Thick ruthenium dioxide and bismuth ruthenate films on aluminium dioxide substrate with palladium silver contacts; epoxy attachment to OFHC adapter; copper leads indium soldered to chip and heat sunk to copper adapter using VGE 7031 varnish | | Leads: | | | Lead material: | 6 in 36 AWG copper leads with heavy build polyimide insulation | | Mass: | | | Limitation: | |
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|  | - Virtually no magnetic field-induced errors
- Capable of mK control stability in the presence of strong magnetic fields
- Monotonic in C versus T to nearly room temperature
| | Leads: | | | Lead material: | Phosphor bronze with heavy build polyimide attached with epoxy strain relief at sensor | | Mass: | | | Limitation: | |
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|  | | | Packaging material: | Alumina base, with metallization: 0.1 µm of molybdenum, 0.2 µm gold | | Leads: | | | Lead material: | | | Mass: | | | Limitation: | |
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|  | - Non-magnetic package
- Exposed flat substrate for surface mounting
| | Packaging material: | Sensing element is mounted to a platinum disk and covered with a dome of Stycast® 2850 epoxy | | Leads: | | | Lead material: | Platinum ribbon with tinned 60/40 SnPb solder | | Mass: | | | Limitation: | |
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|  | - Monotonically decreasing resistivity from 500 K to 0.65 K (sensitivity (dR/dT) falls off in the region of 30 K)
- From 100 K to 273 K the resistance changes linearly with temperature to within 1 K
- Monotonic response at higher temperatures—use over the broad range from 1.4 K to 500 K
| | Packaging material: | Alumina and glass cylindrical case – rhodium-iron alloy wire encapsulated in ceramic | | Leads: | | | Lead material: | | | Mass: | | | Limitation: | |
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|  | | | Packaging material: | BeO ceramic header set into a gold plated copper cylinder | | Leads: | | | Lead material: | Phosphor bronze, insulated with heavy build Polyimide | | Mass: | | | Limitation: | |
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|  | - Temperature range: 1.4 K to 325 K
- Small mass for rapid thermal response
| | Packaging material: | Constructed with platinum, Stycast® epoxy, and alumina | | Leads: | | | Lead material: | | | Mass: | | | Limitation: | |
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The Lake Shore SD Package—the Most Rugged, Versatile Package in the Industry
The SD package, with its sapphire base, direct sensor-to-sapphire mounting, hermetic sealing, and brazed Kovar leads provides the industry's most rugged, versatile sensors with the best thermal connection between the sample and sensor chip. In addition, this package is designed so heat coming down the leads bypasses the sensor chip. It can survive several thousand hours at 500 K and is compatible with most ultra high vacuum applications, and can be indium soldered to samples. The Lake Shore SD package is now available with Cernox™ resistors and GaAlAs diodes, as well as silicon diodes. For the Cernox™ resistors and GaAlAs diodes, the Kovar leads are replaced with nonmagnetic leads. |
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Individual Package Information |
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| Sensor adaptor lead wire colors |
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CD and CU |
DI |
CY |
| Red |
I- |
— |
— |
| Green |
V- |
Cathode (-) |
Cathode (-) |
| Clear |
I+ |
Anode (+) |
— |
| Black/blue |
V+ |
— |
— |
| Yellow |
— |
— |
Anode (+) |
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| Adding length to sensor leads |
| Adding extra wire to your sensor leads can be cumbersome and expensive. Lake Shore offers this service for you at the time you order your sensor. Following are the part numbers and lengths of wire available. A 4-wire configuration is recommended for resistors. |
| Please note: SMODs are not available on devices with gold or no leads (CX-BC, CX-BG, RX-BR, GR-BG, RF-BC, RF-BR, and DT-414-UN) |
| SMOD-L-YYZZ-X |
| SMOD |
Sensor modification |
| L |
Number of leads |
| YY |
Wire type |
| ZZ |
Wire gauge |
| X |
Standard length of wire (ft): 1, 2, 4, 6, 8, 10, 15. Or as required |
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| SMOD leads are attached with 60/40 SnPb solder. If sensor is to be used above 450 K, 90/10 PbSn solder must be specified. Formvar® insulation is limited to use below 378 K. |
| Click here for more information on sensor packages |
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| DT |
duo-twist wire |
gauge = 32 or 36 |
| MW |
manganin wire |
gauge = 30, 32 or 36 |
| NM |
single strand ph-br |
gauge = 32, 36 or 42 |
| QL |
quad-lead |
gauge = 32 or 36 |
| QT |
quad-twist |
gauge = 32 (Polyimide) or 36 (Formvar®) |
| DL |
duo-lead |
gauge = 36 |
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| 2-wire configurations (L=2) |
| Typical lead configuration1 |
| SMOD-2-DT32-(X) |
2-lead, Duo-Twist™ wire, 32 AWG |
clear (+) green (–) |
attach color code tag in the box |
| SMOD-2-DT36-(X) |
2-lead, Duo-Twist™ wire, 36 AWG |
clear (+) green (–) |
attach color code tag in the box |
| SMOD-2-MW30-(X) |
2-lead, manganin wire, 30 AWG |
no color coding |
"+" lead marked with sticker |
| SMOD-2-MW32-(X) |
2-lead, manganin wire, 32 AWG |
no color coding |
"+" lead marked with sticker |
| SMOD-2-MW36-(X) |
2-lead, manganin wire, 36 AWG |
no color coding |
"+" lead marked with sticker |
| SMOD-2-NM32-(X) |
2-lead, non-magnetic wire, 32 AWG |
no color coding |
"+" lead marked with sticker |
| SMOD-2-NM36-(X) |
2-lead, non-magnetic wire, 36 AWG |
no color coding |
"+" lead marked with sticker |
| SMOD-2-NM42-(X) |
2-lead, non-magnetic wire, 42 AWG |
no color coding |
"+" lead marked with sticker |
| Note: No tags needed for platinum (or other 2-lead resistor type) sensors |
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| 4-wire configurations (L=4) |
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| SMOD-4-MW30-(X) |
4-lead, manganin wire, 30 AWG |
no color coding |
"+" lead marked with sticker |
| SMOD-4-MW32-(X) |
4-lead, manganin wire, 32 AWG |
no color coding |
"+" lead marked with sticker |
| SMOD-4-MW36-(X) |
4-lead, manganin wire, 36 AWG |
no color coding |
"+" lead marked with sticker |
| SMOD-4-NM32-(X) |
4-lead, non-magnetic wire, 32 AWG |
no color coding |
"+" lead marked with sticker |
| SMOD-4-NM36-(X) |
4-lead, non-magnetic wire, 36 AWG |
no color coding |
"+" lead marked with sticker |
| SMOD-4-NM42-(X) |
4-lead, non-magnetic wire, 42 AWG |
no color coding |
"+" lead marked with sticker |
| SMOD-4-QL32-(X) |
4-lead, Quad-Lead ™ wire, 32 AWG |
red (l–), green (V–), clear (l+), blue (V+)2 |
| SMOD-4-QL36-(X) |
4-lead, Quad-Lead™ wire, 36 AWG |
red (l–), green (V–), clear (l+), blue (V+)2 |
| SMOD-4-QT32-(X) |
4-lead, Quad-Twist™ wire, 32 AWG |
pair: red (l–) and green (l+)2 pair: clear (V–) and green (V+)2 |
| SMOD-4-QT36-(X) |
4-lead, Quad-Twist™ wire, 36 AWG |
pair: red (l–) and green (l+)2 pair: clear (V–) and green (V+)2 |
1 Subject to change—verify with document included with order 2 For QL-36, QL-32, and QT-36, attach appropriate color code tag in the sensor box |
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| Please note: SMODs are not available on devices with gold or no leads (CX-BC, CX-BG, RX-BR, GR-BG, RF-BC, RF-BR, and DT-414-UN) |
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| Coaxial |
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| SMOD-2-S1-(X) |
2-lead, type S1 coaxial cable |
center cond. (+) and shield (–) |
"+" lead marked with sticker |
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